Solder-bearing lead

Electrical connectors – Metallic connector or contact having part permanently... – Adapted to be secured to conductor formed on printed circuit...

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Details

29860, 29874, H01R 402

Patent

active

051394480

ABSTRACT:
A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.

REFERENCES:
patent: 4120558 (1978-10-01), Seidler
patent: 4605278 (1986-08-01), Seidler
patent: 4679889 (1987-07-01), Seidler
patent: 4697865 (1987-10-01), Seidler
patent: 4737115 (1988-04-01), Seidler
patent: 4780098 (1988-10-01), Seidler
patent: 4883435 (1989-11-01), Seidler

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