Method and apparatus for cleaning edges of contaminated substrat

Cleaning and liquid contact with solids – Processes – Using solid work treating agents

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134902, 15 971, B08B 700

Patent

active

058610669

ABSTRACT:
A method and apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.

REFERENCES:
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patent: 5144711 (1992-09-01), Gill, Jr.
patent: 5311634 (1994-05-01), Andros
patent: 5350428 (1994-09-01), Leroux et al.
patent: 5351360 (1994-10-01), Suzuki et al.
patent: 5485644 (1996-01-01), Shinbara et al.
patent: 5624501 (1997-04-01), Gill, Jr.
Eitoku, Post-CMP Cleaning Technology, Semicon Korea 95, pp. 29-36, Jan 1995 .

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