Method and apparatus polishing wafer for extended effective area

Details Method and apparatus polishing wafer for extended effective area Method and apparatus polishing wafer for extended effective area

1998-11-17

2000-08-29

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

59 63, 59288, 59290, 59398, B24B 100, B24B 2902

Patent

active

061100145

ABSTRACT:
A wafer polishing apparatus includes a carrier and a table. A wafer is mounted on the carrier, and the carrier includes a circumference ring provided around of the wafer. The height of the innermost portion of the circumference ring is equal to or higher than that of a surface of the wafer. The table includes a polishing pad. The carrier and the table are relatively rotated such that the wafer surface is polished by the polishing pad.

REFERENCES:
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5643053 (1997-07-01), Shendon
patent: 5643061 (1997-07-01), Jackson et al.
patent: 5664988 (1997-09-01), Stroupe et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5820448 (1998-10-01), Shamouilian et al.
patent: 5851140 (1998-12-01), Barns et al.
patent: 5876273 (1999-03-01), Yano et al.
patent: 5916015 (1999-06-01), Natalicio
patent: 5931725 (1999-08-01), Inaba et al.

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