Method of trimming photoresist film

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

96 83, 156238, 156247, G03C 190

Patent

active

040750515

ABSTRACT:
The method of this invention forms a laminate of a coversheet, a photoresist film, a substrate and a soft absorbent backup sheet. A solvent or softening agent that will reduce the tear strength of the film is applied to the backup sheet. This weakens the photoresist surrounding the substrate. As the backup sheet is peeled away from the substrate, the weakened photoresist is pulled away with it and is torn or trimmed along the edges of the substrate. This facilitates precise and accurate trimming which is particularly useful on small fragile, irregular shaped substrates. The substrate may then be processed by exposure, development and the like.

REFERENCES:
patent: 1930291 (1933-10-01), Thornton
patent: 3402082 (1968-09-01), Seaman et al.
patent: 3649283 (1972-03-01), Christensen et al.

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