Method for making a tab semiconductor device with self-aligning

Details Method for making a tab semiconductor device with self-aligning Method for making a tab semiconductor device with self-aligning

1995-07-31

1997-11-11

Graybill, David

Fishing, trapping, and vermin destroying

437211, 437217, 437220, H01L 2156, H01L 2158, H01L 21603

Patent

active

056863527

ABSTRACT:
A TAB semiconductor device (98) is manufactured with a TAB tape (62') which provides an intrinsic standoff for the device. The tape (62') has a carrier film (66'), having at least one cavity, and a plurality of conductors (64) on the top surface of the carrier film. A semiconductor die (42) is substantially centered either inside or below the cavity in the film. The conductors overlie bonding sites (44) on the active surface of the die. Inner-lead-bonds are made between the conductors and the bonding sites, wherein the conductors bend at the edges (65') of the cavity in order to contact the bonding sites, thus concurrently achieving a downset during the action of bonding. An encapsulant (99) provides protection to the die, the inner-lead-bonds, and a portion of the conductors.

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