Method of forming a die-to-insert permanent connection

Details Method of forming a die-to-insert permanent connection Method of forming a die-to-insert permanent connection

1995-12-22

1997-11-11

Niebling, John

Fishing, trapping, and vermin destroying

437183, 324765, H01L 2166

Patent

active

056863187

ABSTRACT:
The invention disclosed herein is a semiconductor die assembly and method of making the same having a die and insert substrate that are electrically interconnected by diffusing gold bumps attached to the connecting surface of the substrate to aluminum-based bond pads on the die to form a permanent die-to-insert connection. The process for diffusing the gold bumps into the bond pads preferably occurs during a burn-in process wherein pressure and heat are applied to the die/substrate assembly without melting the gold bumps until a permanent die-to-insert substrate connection is properly made.

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