Thin film wiring board

Details Thin film wiring board Thin film wiring board

1995-11-07

1997-11-11

Woodward, Ana

Stock material or miscellaneous articles

Composite

Of polyimide

428209, 428901, 174110SR, B32B 2706

Patent

active

056861915

ABSTRACT:
A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

REFERENCES:
patent: 4826927 (1989-05-01), Schmid et al.
Patent Abstracts of Japan, vol. 15, No. 425.
Patent Abstracts of Japan, vol. 9, No. 32.

Affiliated with

Also associated with

Rating

Thin film wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1227380