Process for making an interconnect bump for flip-chip integrated

Details Process for making an interconnect bump for flip-chip integrated Process for making an interconnect bump for flip-chip integrated

1994-06-02

1995-11-14

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

22818022, H01L 21283, H01L 21441

Patent

active

054666350

ABSTRACT:
An interconnect bump is formed on a substrate structure of a flip-chip microelectronic integrated circuit by sputtering a metal base layer on the substrate, and then forming a copper standoff on the base layer. A solder cap is formed on the standoff having a peripheral portion that extends laterally external of the standoff. The peripheral portion of the cap is used as a self-aligned mask for a photolithographic step that results in removing the metal base layer except under the standoff and the cap. The cap has a lower melting point than the standoff. Heat is applied that is sufficient to cause the cap to melt over and coat the standoff and insufficient to cause the standoff to melt. The peripheral portions of the cap and the base layer that extend laterally external of the standoff cause the melted solder to form into a generally hourglass shape over the standoff due to surface tension.

REFERENCES:
patent: 4427715 (1984-01-01), Harris
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5272376 (1993-12-01), Ueno
patent: 5349500 (1994-09-01), Casson et al.

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