Process for fabricating integrated devices including nonvolatile

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 43, 437 48, 437904, H01L 218247

Patent

active

054666228

ABSTRACT:
A process for simultaneously fabricating memory cells, transistors, and diodes for protecting the tunnel oxide layer of the cells, using the DPCC process wherein the first polysilicon layer is not removed from the transistor area, and the gate regions of the transistors are formed by shorted first and second polysilicon layers. To form the diodes, the polyl layer is removed from the active areas in which the diodes are to be formed, using the same mask employed for shaping polyi; the interpoly dielectric layer and the gate oxide layer are removed from the active areas of the diodes, using the same mask employed for removing the dielectric layer from the transistor area; a second polysilicon layer is deposited directly on to the active areas of the diodes; and the poly2 doping ions penetrate the active areas to form N+ regions which, together with the substrate, constitute the protection diodes. The diodes are thus formed prior to shaping poly2, and are connected to the control gates of the cells by the second polycrystalline silicon layer strips forming the word lines.

REFERENCES:
patent: 4635347 (1987-01-01), Liem et al.
patent: 4775642 (1988-10-01), Chang et al.
patent: 5036018 (1991-07-01), Mazzali
patent: 5183773 (1993-02-01), Miyata

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for fabricating integrated devices including nonvolatile does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating integrated devices including nonvolatile, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating integrated devices including nonvolatile will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1220578

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.