Method for fabricating a semiconductor package

Details Method for fabricating a semiconductor package Method for fabricating a semiconductor package

1993-10-04

1995-11-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 524, 437218, H05K 334

Patent

active

054654815

ABSTRACT:
A semiconductor package (100) and module (300) includes a unitary base structure (101) and alignment mechanisms (104). The unitary base structure (101) includes a semiconductor mounting area (102) and encircling walls (103). The structure provides resistance to bowing as compared to a flat base. The lack of bowing provides improved thermal contact to a cold plate of the operating environment. The lack of bowing also reduces certain failure modes. The alignment mechanism (104) aligns module components during assembly, thereby simplifying assembly by eliminating the need for complicated fixtures which hold components in place.

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6th Intr SAMPE Electron Conf Jun. 22-25, 1992 pp. 295-307 a paper by J. A. Horner et al.

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