Printed circuit board and method for the manufacture of same

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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4283043, 4283213, 428901, 29829, 29830, 29835, 29837, 29841, 29845, 29852, 361748, 361749, 361751, 361760, 361803, 174264, B32B 900, B32B 3120, H05K 302, H05K 346

Patent

active

058886273

ABSTRACT:
It is an object of the present invention to provide a highly reliable printed circuit board subject to little bowing or twisting of the substrate, wherein the substrate and metal wiring are securely bonded together, and stable electrical and mechanical connection is achieved between the metal wiring and electroconductive resin paste filled into the through holes, and to provide a method of manufacture for same. The present invention relates to a printed circuit board having a multilayer wiring structure comprising a plurality of sheet substrates consisting of resin component layers containing an inorganic filler formed onto both sides of an organic nonwoven fabric material, and two or more circuit patterns, wherein through holes are formed in the sheet substrates in the thickness direction thereof and an electroconductive resin component is filled into the through holes, forming electrical connection between each of the electrode layers, and to a method of manufacture for same.

REFERENCES:
patent: 4910077 (1990-03-01), Benedikt
patent: 5269863 (1993-12-01), Middelman
patent: 5346750 (1994-09-01), Hatakeyama et al.
Derwent Abstracts 86-186071, "Metal Clad Laminated Sheet Prodn.", Jun. 1986 .

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