Electronic component mounting apparatus and method of mounting e

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29705, 29720, 29741, H05K 1304

Patent

active

051778645

ABSTRACT:
A method of mounting an electronic component having a plurality of leads on a printed circuit board. The method includes the steps of roughly observing the position of an electronic component, held by a suction nozzle of a carrier turntable, by a camera constituting part of a recognition unit and determining the rough deviation of the observed position from a desired position, roughly correcting the relative position of the electronic component and the circuit board by relative movement of the circuit board and the suction nozzle in the X and Y directions of the circuit board and the direction .THETA. around an axis of rotation of the nozzle which extends through the electronic component in response to any rough deviation of the electronic component relative to the desired position thereof on the circuit board, precisely measuring the positional deviation of the electronic component by precisely measuring the deviation of the position of at least one lead of the electronic component from a desired position by means of a laser unit, precisely correcting the relative position of the electronic component and the circuit board by relative movement of the circuit board and the suction nozzle in the X and Y directions of the circuit board and the direction .THETA. around an axis of rotation which extends through the circuit board in a direction perpendicular to the surfaces of the circuit board in response to any precisely measured positional deviation, and placing the electronic component on the circuit board.

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