Probe method and apparatus with improved probe contact

Details Probe method and apparatus with improved probe contact Probe method and apparatus with improved probe contact

1996-03-19

1998-07-07

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 106

Patent

active

057774854

ABSTRACT:
A probe apparatus in which a wafer having IC chips arrayed with electrode pads is supported by a pedestal, and the pedestal is moved relatively to a probe card in the X, Y, Z directions to bring the electrode pads into contact with probes of the probe card so as to perform an electric measurement of the part to be inspected, the apparatus includes a parameter setting part for setting a distance in the Z direction between the probe and the electrode pad when the pedestal is moved along the X, Y planes to specify the initial position of the chip, a memory unit for storing the distance in the Z direction set by the parameter setting part, and a control unit for moving the pedestal in the Z direction in a manner to be apart from the probe card on the basis of the distance in the Z direction stored in the memory unit to move the chip to the initial position, and moving relatively the pedestal in the Z direction from the position to the probe card so as to contact the electrode pad of the chip with the probe.

REFERENCES:
patent: 4780836 (1988-10-01), Miyazaki et al.
patent: 5369358 (1994-11-01), Metzger et al.
patent: 5436571 (1995-07-01), Karasawa
patent: 5550480 (1996-08-01), Nelson et al.

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