Poly(ester-amide) hot-melt adhesive

Details Poly(ester-amide) hot-melt adhesive Poly(ester-amide) hot-melt adhesive

1984-09-04

1986-02-11

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528336, 528338, 528339, 528346, C08G 6944

Patent

active

045699879

ABSTRACT:
There is disclosed a group of poly(ester-amide) compositions which possess unexpectedly good low temperature adhesive properties with respect to vinyl based substrates. These poly(ester-amide) compositions are the reaction product of a polymeric fatty acid, with an organic diamine, dicarboxylic acid and an alkanolamine having the general formula: ##STR1## wherein R.sub.2 represents alkylene of 2 to 8 carbons, and R.sub.1 is selected from the group consisting of hydrogen and a monovalent moiety of the formula:

REFERENCES:
patent: 3377303 (1968-04-01), Peerman et al.
patent: 4515939 (1985-05-01), Frihart et al.

Affiliated with

Also associated with

Rating

Poly(ester-amide) hot-melt adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Poly(ester-amide) hot-melt adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Poly(ester-amide) hot-melt adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1206372