Process for collective manufacture of chips with electrodes sele

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438 17, H01L 2166

Patent

active

057767912

ABSTRACT:
This process comprises the following steps:

REFERENCES:
patent: 4676761 (1987-06-01), Poujois
patent: 5008617 (1991-04-01), Czubatys et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5120421 (1992-06-01), Glass et al.
patent: 5256578 (1993-10-01), Corley et al.
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5422498 (1995-06-01), Nikawa et al.
patent: 5472561 (1995-12-01), Williams et al.
patent: 5543334 (1996-08-01), Yoshii et al.
Sensors and Actuators A, vol. A43, Nos. 1-3, pp.296-301, Jan. 1, 1994, R. Kakerow, et al., "A Monolithic Sensor Array Of Individually Addressable Microelectrodes".
Sensors and Actuators B, vol. B19, Nos. 1-3, pp. 675-677, 1994, G.C. Fiaccabrino, et al., "Array Of Individually Addressable Microelectrode".
Patent Abstracts of Japan, vol. 13, No. 460, Oct. 18, 1989, JP-A-01 179995, Jul. 18, 1989.
"Fluxless Flip-Chip Technology", Patrice Caillat, et al., pp. 1-5 no date.
Sensors and Actuators B, vol. B21, No. 1, pp. 33-37, T. Hermes, et al., "An Amperometric Microsensor Array With 1024 Individually Addressable Elements For Two-Dimensional Concentration Mapping" Sep. 1993.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for collective manufacture of chips with electrodes sele does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for collective manufacture of chips with electrodes sele, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for collective manufacture of chips with electrodes sele will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1204928

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.