Tape-on-wafer mounting apparatus and method

Details Tape-on-wafer mounting apparatus and method Tape-on-wafer mounting apparatus and method

1993-03-08

1994-02-15

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156299, 156580, 1565833, 100211, 100299, B32B 3100

Patent

active

052863298

ABSTRACT:
A tape-on-wafer mounting apparatus and method for mounting a dicing tape on a wafer. The wafer stage mounts a wafer in the hole, which is constructed such that, when the wafer is mounted there, the wafer top surface stands higher than the wafer stage surface, with the wafer surface on which chip circuits are fabricated faced down. The tape stage mounts a dicing tape on its ring with the tape surface on which adhesives are applied faced down. The tape pressing tool presses the tape stage on the wafer stage so that the tape presser, which is constructed such that vertical force exerted by it is the largest at its center and smaller with the increase in distance from the center, causes the dicing tape to stick to the wafer.

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