Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-07-31
1994-02-15
Schwartz, Larry I.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, 439 73, H01R 909
Patent
active
052862097
ABSTRACT:
An IC socket which can be used commonly in IC packages whose outer leads are different from each other. A receiving base having a stepped bottom surface on which an IC package is placed is movably disposed in a first hole of a main body portion of the IC socket. A sliding member having a stepped top surface is brought into abutment with the stepped bottom surface of the receiving base and is movably disposed in a second hole of the main body portion. By sliding the sliding member, the height of the receiving base can be changed in steps in accordance with the stepped bottom surface, making it possible to change the height of the receiving base according to the shape of the outer leads of an IC package placed on the receiving base.
REFERENCES:
patent: 4407555 (1983-10-01), Lockard
patent: 4789345 (1988-12-01), Carter
patent: 4824389 (1989-04-01), Doyle et al.
patent: 4887969 (1989-12-01), Abe
Mitsubishi Denki & Kabushiki Kaisha
Schwartz Larry I.
Vu Hien D.
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