Semiconductor package having side walls, earth-bonding terminal,

Details Semiconductor package having side walls, earth-bonding terminal, Semiconductor package having side walls, earth-bonding terminal,

1988-01-25

1989-04-25

James, Andrew J.

Incremental printing of symbolic information

Ink jet

Ejector mechanism

357 68, 357 69, 357 70, 357 72, 357 80, 357 81, H01L 2348, H01L 2302, H01L 3902

Patent

active

048252824

ABSTRACT:
A semiconductor device comprising: a base plate for mounting a semiconductor chip; side walls disposed on the base plate to surround the semiconductor chip; an input lead piece and an output lead piece, both being connected to the semiconductor chip and extending outward from the side walls; and at least one earth lead piece extending outward from the side wall between the positions from where the input and output lead pieces are taken out. The side walls at the positions from where the input and output lead pieces are taken out are made of electrical insulation material. The side wall at the position from where the earth lead piece is taken out is made of metal as one body integral with a bonding terminal extending inward of the side wall and the earth lead piece extending outward of the side wall.

REFERENCES:
patent: 3502786 (1970-03-01), Stoll
patent: 3801938 (1974-04-01), Goshgarian
patent: 3864727 (1975-02-01), Schoberl
patent: 3893193 (1975-07-01), Anazawa et al.
patent: 3946428 (1976-03-01), Anazawa et al.
patent: 4030001 (1977-06-01), Medley, Jr. et al.
patent: 4297722 (1981-10-01), Nagahama et al.
IBM Technical Disclosure Bulletin, vol. 18, No. 7, Dec. 1975, DeBar et al, "Module Spark Gap".

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