Method of producing piezoelectric/electrostrictive film element

Details Method of producing piezoelectric/electrostrictive film element Method of producing piezoelectric/electrostrictive film element

1996-08-08

1998-07-07

Hall, Carl E.

Metal working

Piezoelectric device making

310328, H01L 4122

Patent

active

057749612

ABSTRACT:
A piezoelectric/electrostrictive film element which includes a ceramic substrate having at least one window and an integrally formed diaphragm portion for closing each window, and a piezoelectric/electrostrictive unit including a lower electrode, a piezoelectric/electrostrictive layer and an upper electrode, which are formed in this order on the diaphragm portion. The piezoelectric/electrostrictive layer consists of a dense body having a crystal grain size of not smaller than 0.7 .mu.m, and a porosity (x) of not greater than 15%, and the diaphragm portion has a deflection percentage (y) of 0-8%, which is a percentage of an amount of deflection of a central part of the diaphragm portion, with respect to a length of a shortest line which extends across the corresponding window and passes a center of the window. Further, the porosity (x) and the deflection percentage (y) satisfies the following formula: y.ltoreq.0.1167x.sup.2 -3.317x+25.5. Three methods for producing the piezoelectric/electrostrictive film element are described.

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"Introduction to Ceramics" by W. Kingery et al. pp. 518-521.

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