Radiation imagery chemistry: process – composition – or product th – Transfer procedure between image and image layer – image... – Image layer portion transfer and element therefor
Patent
1979-08-24
1981-09-08
Schilling, Richard L.
Radiation imagery chemistry: process, composition, or product th
Transfer procedure between image and image layer, image...
Image layer portion transfer and element therefor
430271, 430273, G03C 1112, G03C 176
Patent
active
042885256
ABSTRACT:
Photosensitive materials are described which may be used in a variety of applications such as making dry transfer materials, resist masks, printing plates and silk screen stencils. The material consists of two carrier sheets may be peeled apart and which are laminated together via at least two interlayers viz. a photosensitive layer and an image forming layer. Prior to exposure, if the carrier sheets are peeled apart the carrier sheet adjacent the photosensitive layer separates wholly from it leaving both photosensitive layer and image forming layer on the other carrier sheet. After exposure, if the sheets which are peeled apart the whole of the photosensitive layer and at least part of the image forming layer remains attached to the carrier sheet adjacent the photosensitive layer.
By incorporating adhesive in or adjacent the shearable image forming layer, the photosensitive material may constitute a material from which dry transfers may be manufactured simply by imagewise exposure and peeling apart.
REFERENCES:
patent: 3010390 (1961-11-01), Buskes
patent: 3091528 (1963-05-01), Buskes
patent: 3615435 (1971-10-01), Chu et al.
patent: 3770438 (1973-11-01), Celeste
patent: 4050936 (1977-09-01), Takeda et al.
patent: 4081282 (1978-03-01), Merrill et al.
Shepherd John V.
Sutton Eric M.
LandOfFree
Photosensitive materials does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive materials will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1192734