Process for encapsulating electrical components by vortex sinter

Details Process for encapsulating electrical components by vortex sinter Process for encapsulating electrical components by vortex sinter

1979-06-18

1981-09-08

Beck, Shrive P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 58, 427185, 427195, 427282, 427300, B05D 132

Patent

active

042884683

ABSTRACT:
A process for encapsulating electrical components with a continuous layer of synthetic resin material contemplates induction heating of the component by high frequency current with the component leads covered by heat insulating material, and subjecting the heated component to a vortex bath of synthetic resin powder so as to fuse or sinter the powder to the component. Because the leads have not been heated, no resin is sintered thereto, so that scraping or other removal of resin from the leads to make electrical contact therewith need not be undertaken as an additional step. During hardening of the resin the heat insulation may be left in place on the leads to allow the hardened resin to form "feet" on a base of the component, or the heat insulation may be displaced slightly to allow flow of the hardening resin around the lead without forming a fillet.

REFERENCES:
patent: 2844489 (1958-07-01), Gemmer
patent: 3226245 (1965-12-01), Dettling
patent: 3367789 (1968-02-01), Mommsen
patent: 3440078 (1969-04-01), Sharetts
patent: 3470010 (1969-09-01), Christiansen
patent: 3565664 (1971-02-01), Al
patent: 3756852 (1973-09-01), Scheetz et al.
patent: 3864798 (1975-02-01), Utner
patent: 3875898 (1975-04-01), Braden
patent: 3884182 (1975-05-01), Jones
patent: 4013807 (1977-03-01), Putney et al.

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