Die bonding apparatus

Details Die bonding apparatus Die bonding apparatus

1988-02-09

1989-04-25

Godici, Nicholas P.

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

228 11, 228248, 118668, B23K 306

Patent

active

048240060

ABSTRACT:
A die bonding apparatus comprising a paste supply section having a needle for supplying paste onto a package to secure a semiconductor pellet, a driving section for moving the paste supply section in the directions of X, Y and Z, respectively, a follow-up mechanism movable up and down for causing the tip of the needle to follow the contour of the paste application surface of the package and a support mechanism for supporting the paste supply section through the follow-up mechanism.

REFERENCES:
patent: 4485957 (1984-12-01), Sugimoto et al.
patent: 4607782 (1986-08-01), Mims

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