Semiconductor component with pressure contact

Details Semiconductor component with pressure contact Semiconductor component with pressure contact

1983-08-25

1985-06-11

Sikes, William L.

357 75, H01L 2342, H01L 2344, H01L 2346

Patent

active

045232199

ABSTRACT:
Semiconductor component, including a case having a metal bottom, at least one semiconductor body disposed in the case and having first and second principal surfaces, the first principal surface being in at least thermal contact with the metal bottom, at least one lead electrode in contact with the second principal surface, a spring anchored in the metal bottom and pressing the metal bottom, semiconductor body and lead electrode together into contact with each other, casting compound at least partially filling the case and contacting given surfaces of the spring seating the spring in the casting compound, and a permanently elastic synthetic resin mass at least partially coating the given surfaces of the spring being in contact with the casting compound.

REFERENCES:
patent: 2946935 (1960-07-01), Finn, Jr.
patent: 4100566 (1978-07-01), Okikawa et al.
patent: 4224663 (1980-09-01), Maiese et al.
patent: 4246596 (1981-01-01), Iwasaki
patent: 4314271 (1982-02-01), Heyke et al.
patent: 4381518 (1983-04-01), Bahlinger

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