High I/O density MLC flat pack electronic component

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174261, 174255, 361767, 361772, 361774, H05K 702

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active

057903867

ABSTRACT:
A flat pack electronic component having input/output pads thereon which are electronically connected to an outside device comprising a multilayer ceramic substrate having a plurality of individual electrical conductors in the substrate a chip secured to the substrate; and a plurality of input/output pads on at least one surface of the substrate at the periphery of said substrate with sites on the chip being electrically connected to the pads by one of the individual electrical conductors.

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