Surface complemental heat dissipation device

Details Surface complemental heat dissipation device Surface complemental heat dissipation device

1997-11-05

1998-08-04

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257720, 361709, H05K 720

Patent

active

057903794

ABSTRACT:
A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.

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IBM Tech Discl Bull, vol. 3, No. 1, Jun. 1988, p. 2, Film on Metal Leaded Chip Carrier.

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