Lead frame having deflectable and thereby precisely removed tie

Details Lead frame having deflectable and thereby precisely removed tie Lead frame having deflectable and thereby precisely removed tie

1995-02-16

1996-12-24

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257666, 257674, 257669, H01L 2160, H01L 2350

Patent

active

055876064

ABSTRACT:
A lead frame includes a die pad on which a semiconductor chip is mounted, a plurality of leads each having an end which faces the die pad, and tie bars connecting the leads, wherein each of the tie bars is formed so as to project from a surface of each of the leads by an amount sufficient to break a boundary between a tie bar and a lead when the tie bar is pushed back so that the tie bar and lead is separated. The method for producing a semiconductor device using the above lead frame includes steps of clamping by molding dies the lead frame having the semiconductor chip mounted on the die pad so that the tie bar is pushed back and cut off and encapsulating the semiconductor chip by resin so that a package made of the resin is formed, and releasing the lead frame from clamping by the molding dies and removing the tie bar pushed back by the clamping from the lead frame.

REFERENCES:
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 5083186 (1992-01-01), Okada et al.
patent: 5100498 (1992-03-01), Takeuchi et al.
patent: 5104827 (1992-04-01), Schneider et al.
patent: 5176366 (1993-01-01), Masumoto et al.
patent: 5230144 (1993-07-01), Ootsuki
patent: 5336272 (1994-08-01), Tsutsumi et al.

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