Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1996-11-15
1998-08-04
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, H01L 2334
Patent
active
057898162
ABSTRACT:
A multiple-chip IC package used to contain a number of chips therein is provided. The multiple-chip IC package includes a leadframe, at least one IC chip mounted on the leadframe, and at least one dummy chip mounted on a second area on the leadframe. On the dummy chip, there is provided with a plurality of bonding pads which serve as intermediate bonding pads between the chips and the pins on the leadframe so that any two connecting points are connected by a number of straight wires via the dummy chip. This allows the wire bonding process to be much easier to conduct. Further, the method for assembling this multiple-chip IC package includes a first step of mounting the chips on a leadframe; a second step of mounting at least one dummy chip having a plurality of bonding pads thereon on a selected area on the leadframe; and a third step of conducting a wire bonding process to interconnect between the chips and the pins.
REFERENCES:
patent: 5075758 (1991-12-01), Aizawa
patent: 5084753 (1992-01-01), Goida et al.
patent: 5245216 (1993-09-01), Sako
patent: 5373188 (1994-12-01), Michii et al.
Jackson Jerome
Kelley Nathan K.
United Microelectronics Corporation
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