Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-08-20
1999-10-05
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361783, 257686, 257723, 257777, 257787, 438126, 600374, H01L 2331, H05K 118
Patent
active
059634294
ABSTRACT:
A printed circuit board substrate includes cavities in which electronic components, such as integrated circuits, are mounted and encapsulated. Once the electronic components are encapsulated, other electronic components can be mounted above the encapsulated component on the top surface of the substrate, thereby increasing the number of components that can be mounted to a circuit board of a given area. The encapsulated components are mounted using any one of a variety of techniques. The substrate may include multiple conductive layers for electrically interconnecting the encapsulated components to other components.
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patent: 5608262 (1997-03-01), Degani et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5801438 (1998-09-01), Shirakawa et al.
patent: 5831833 (1998-11-01), Shirakawa et al.
Direct Chip Interconnect Using Polymer Bonding by Ken Gilleo, IEEE publ. no. 0569-5503/89/0037, pp. 37-39, 1989.
Picard Leo P.
Sulzer Intermedics Inc.
Vigushin John B.
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