Electronic micropackaging assembly and its fabrication

Details Electronic micropackaging assembly and its fabrication Electronic micropackaging assembly and its fabrication

1997-05-19

1999-10-05

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361715, 361790, 361796, 361803, H05K 720

Patent

active

059634260

ABSTRACT:
A multilayer microelectronic module assembly has at least two planar module structures, in the form of boards lying parallel to each other and which must be electrically interconnected. Each planar module structure has electronic circuitry thereon and electrical interconnect locations in registry with corresponding electrical interconnect locations on the adjacent planar module structure. The electrical interconnections are accomplished by closely spaced direct electrical interconnectors extending between the respective electrical interconnection locations on the adjacent planar module structures. Each module assembly is preferably affixed to a support. Multiple supports are arranged parallel to each other and electrically interconnected by similar direct electrical interconnectors. By accomplishing the electrical interconnections using direct electrical interconnectors rather than a conventional backplane, there is room at the periphery of the planar module structures for attachment to a thermally conductive heat sink, which efficiently removes heat generated by the electronic circuitry on the planar module structures.

REFERENCES:
patent: 4453795 (1984-06-01), Moulin
patent: 4764846 (1988-08-01), Go
patent: 5197184 (1993-03-01), Crumly et al.
patent: 5307561 (1994-05-01), Feigenbaum et al.
Audi "Colling and Minimizing Temperature Gradient In Stacked Modules" IBM Tech Disc Bulletin, vol. 19, No. 2, Jul. 1976, p. 414. 361/707.

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