Flip-chip resin sealing structure and resin sealing method

Details Flip-chip resin sealing structure and resin sealing method Flip-chip resin sealing structure and resin sealing method

1998-07-30

2000-04-11

Cuchlinski, Jr., William A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361714, 361704, 361713, 361718, 361719, 361679, 257783, 257777, 438108, 438127, H01L 2328

Patent

active

060490381

ABSTRACT:
A sealing resin mixed with filler is used to seal a space between a flip-chip mounted semiconductor device and a printed circuit board. An integrated circuit chip joined to the printed circuit board by metal bumps, has the sealing resin interposed in the space between the chip and the board. The density of the filler in the sealing resin varies such that there is a relatively greater amount of filler at or near the integrated circuit chip. This allows the coefficient of thermal expansion of the resin layer adjacent the chip to better match the coefficient of thermal expansion of the silicon which makes up the chip.

REFERENCES:
patent: 5450283 (1995-09-01), Lin et al.

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