Manufacturing method of SiC Schottky diode

Semiconductor device manufacturing: process – Forming schottky junction – Compound semiconductor

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438571, H01L 2128

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057893110

ABSTRACT:
A Schottky electrode is formed on an n-type SiC base member with an Al--Ti alloy or by laying Al films and Ti films alternately, and a resulting structure is subjected to a heat treatment of 600.degree. C. to 1,200.degree. C. A p-type SiC layer may be formed around the Schottky junction so as to form a p-n junction with the n-type SiC base member.

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