Standardized bonding location process and apparatus

Details Standardized bonding location process and apparatus Standardized bonding location process and apparatus

1998-02-13

2000-04-11

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438612, 438613, H01L 2144

Patent

active

060487534

ABSTRACT:
A process for making a semiconductor device and the resulting device having standardized die-to-substrate bonding locations are herein disclosed. The semiconductor die provides a standardized ball grid or other array of a particular size, pitch and pattern such that as the size, configuration or bond pad arrangement of the die changes, a standard substrate, (the term including leadframes) having a similarly standardized array of terminals or trace ends can be employed to form a semiconductor device. It is also contemplated that dice having markedly different circuitry but a common array pattern may be employed with the same substrate or other carrier.

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