Method for wire bonding

Details Method for wire bonding Method for wire bonding

1994-08-30

1996-12-24

Bradley, P. Austin

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281101, 2281805, B23K 2010, B23K 3102

Patent

active

055867138

ABSTRACT:
A wire bonding method includes the steps of a lowering a capillary tool supplying a wire, restraining the lowering of the capillary tool, and wire bonding the wire to a bonding face. The inertial force of the capillary tool is reduced to almost zero by restraining the lowering of the capillary tool. As a result, wire bonding is performed under proper bonding force since no bonding force is applied to a ball on the tip of wire from the inertial force of the capillary tool. The bonding force is provided using torque control from an electric motor which lowers the capillary tool.

REFERENCES:
patent: 4444349 (1984-04-01), Bilane et al.
patent: 4789095 (1988-12-01), Kobayashi
patent: 5024367 (1991-06-01), Terakado et al.
patent: 5078312 (1992-01-01), Ohashi et al.
patent: 5115960 (1992-05-01), Shimizu
patent: 5443200 (1995-08-01), Arikado

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