Electronic apparatus having semiconductor device

Details Electronic apparatus having semiconductor device Electronic apparatus having semiconductor device

1988-07-28

1990-02-13

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 72, 361417, 228123, H01L 2302

Patent

active

049011375

ABSTRACT:
Disclosed is an electronic apparatus wherein a large power consumption type semiconductor device is mounted on a ceramic substrate of sintered aluminum nitride with high thermal conductivity for improving a heat dissipation effect. The electronic apparatus is, for example, an ignitor. The aluminum nitride-made ceramic substrate having the semiconductor device is provided in a metallic vessel made of aluminum or the like. Employed is a thermal stress strain-resistant adhesive agent with high thermal conductivity such as a silicone type adhesive agent for bonding. The thermal stress strain-resistant adhesive agent layer serves as a cushioning layer for a heating and cooling cycle and therefore improves a heat cycle resistance.

REFERENCES:
patent: 4540673 (1985-09-01), Takeda et al.
patent: 4770953 (1988-09-01), Horiguchi et al.
Kurokawa et al., "Highly Thermal Conductive Aluminum Nitride Substrate", 298 NEC Research & Development, Apr. 1987, No. 85, pp. 15-21.

Affiliated with

Also associated with

Rating

Electronic apparatus having semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic apparatus having semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic apparatus having semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1172274