Diffusion barrier for copper features

Details Diffusion barrier for copper features Diffusion barrier for copper features

1991-03-15

1992-11-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437190, H01L 2144

Patent

active

051643324

ABSTRACT:
A diffusion barrier which reduces the diffusion of a copper feature into an oxygen containing polymer is provided by a copper metal alloy. The diffusion barrier is fabricated by coating a metal on a copper feature, heating the metal and copper feature to form an alloy of the copper feature and the metal, etching the non-alloyed metal which covers the alloy, and depositing an oxygen containing polymer on the alloy. Preferably the metal is aluminum and a copper aluminum alloy diffusion barrier is at least 300 angstroms thick and contains at least 8 percent aluminum on the surface in contact with the polymer.

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S. Wolf et al., Silicon Processing for the VLSI Era, Lattice Press, Sunset Beach, Calif., 1986, pp. 57,58, 367.

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