Method of manufacturing bipolar transistor having a reduced para

Fishing – trapping – and vermin destroying

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437 32, 437 33, 437 38, 437 69, 437162, 437164, 437203, H01L 21331

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049803026

ABSTRACT:
A bipolar semiconductor device comprises a substrate, a collector region formed of an epitaxial layer of a first conduction type formed on the substrate, a field oxide layer formed on the epitaxial layer so as to define a device formation zone in a device isolation manner, a recess formed in the device formation zone in alignment with an edge of the field oxide layer, a polycrystalline silicon layer of a second conduction type opposite to the first conduction type and formed on a side wall of the recess and on the field oxide layer, and an base region composed of a graft base region and an active base region. The graft base region is formed of a diffused region of the second conduction type formed in the epitaxial layer within the device formation zone by diffusion of impurity from the polycrystalline silicon layer of the second conduction type, and the active base region is formed of a doped region of the second conduction type formed integrally with the polycrystalline silicon layer of the second conduction type under a bottom surface of the recess. The semiconductor device also comprises an insulating layer formed to cover the polycrystalline silicon layer of the second condution type, a polycrystalline silicon layer of the first conduction type formed on at least a bottom of the recess, and an emitter region formed of a diffused region of the first conduction type formed in the diffused region of the second conduction type by diffusion of impurity from the polycrystalline silicon layer of the first conduction type.

REFERENCES:
patent: 4492008 (1985-01-01), Anantha et al.
patent: 4642880 (1987-02-01), Mitzutani et al.

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