Method for reducing mobile ion contamination in semiconductor in

Fishing – trapping – and vermin destroying

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437 62, 437190, H01L 21306

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049803018

ABSTRACT:
In a method of fabricating semiconductor integrated circuits, the effects of mobile ion contamination in a dielectric layer which has been subjected to a source of mobile ion contamination, e.g., reactive ion etching, is substantially eliminated by removing substantially only the topmost portion of the dielectric layer, e.g., 10-15 nm of an 800 nm layer, promptly after performing the step which produced the source of contamination.

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patent: 4810673 (1989-03-01), Freeman
VLSI Technology, Sze, S. editor; McGraw-Hill Book Co., N.Y. (1983), p. 336.

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