Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Patent
1989-09-08
1992-01-21
Bleutge, John C.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
525488, 525530, C08L 6300, C08L 7908
Patent
active
050828800
ABSTRACT:
A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent (c) an inorganic filler and (d) a special polymaleimide is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, this semiconductors such as flat packages, there semiconductors provide high reliability.
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patent: 4816531 (1989-03-01), Young
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Derwent File Supplier, Japanese Patent Office, JP-A-63 230 728, Mar. 20, 1987.
Derwent File Supplier, Japanese Patent Office, JP-A-01 045 426, Feb. 17, 1989.
Asahina Koutarou
Kitahara Mikio
Kubo Takayuki
Machida Koichi
Torikai Motoyuki
Bleutge John C.
Mitsui Toatsu Chemicals Inc.
Sellers II Robert E. L.
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