Method of making high density integrated circuit module

Details Method of making high density integrated circuit module Method of making high density integrated circuit module

1998-02-11

1999-10-05

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

257685, 257686, 257724, 361735, H01R 4300

Patent

active

059605391

ABSTRACT:
A high density integrated circuit module having complex electrical interconnection is described, which includes a plurality of stacked level-one integrated circuit devices, wherein each level-one device includes an integrated circuit die and a plurality of electrical leads extending from the die; and a plurality of non-linear rails adapted to electrically and thermally interconnect selected leads of selected stacked level-one devices within the module, wherein at least some of the plurality of non-linear rail include a lead interconnect portion which is adapted to at most partially surround and receive a selected lead from one of the stacked level-one devices. Other embodiments include TSOP modules having leads reduced in width to allow additional selected non-linear rails to interconnect with select leads in the module. Strain relief for the rail/circuit board substrate connection in harsh environment applications is also provided.

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