Electricity: conductors and insulators – Boxes and housings – With electrical device
Patent
1990-02-12
1991-02-05
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
With electrical device
357 74, 357 70, 295921, H01L 2302
Patent
active
049907204
ABSTRACT:
An electric circuit assembly includes a copper pin (310) extending through aligned apertures (304, 314) in a directly bonded ceramic substrate (302) and copper lead frame (312), and directly bonded to the substrate (302). The pin (310) has an enlarged flange head (322) at one end, and is thermally deformed and enlarged at the other end (324) during the direct bonding. In another embodiment, one end (342) of a copper pin (340) extends out of an aperture (334) in a ceramic substrate (332) and slightly beyond the substrate surface (336). A lead frame (346) is directly bonded to the substrate surface (336) and droops around the protruding end (342) os the pin (340) and conforms thereto during the heating during the direct bonding. The lead frame (346) has a humped configuration over the aperture (334) in the substrate (332) and engages the protruding end (342) of the pin (340) and is deformed and raised thereby away from the substrate surface (336). In one form, the lead frame (346) is directly bonded to the substrate surface (336) around the entire perimeter of the protruding end (342) of the pin (340) and forms a hermetic seal with the substrate surface (336) peripherally surrounding the protruding pin end (342).
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"Over 50 Years of Experience with the Direct Bond Copper Process", Tegmen Corp., 1201 E. Fayette St., Syracuse, New York 13210.
Ledynh Bot L.
Picard Leo P.
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