Hermetically sealed chip carrier with metal cover having pre-pou

Details Hermetically sealed chip carrier with metal cover having pre-pou Hermetically sealed chip carrier with metal cover having pre-pou

1989-07-13

1991-02-05

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H05K 506

Patent

active

049907190

ABSTRACT:
A hermetically sealed chip carrier including a lead frame for use with an EEPROM chip, the carrier including a pre-molded plastic base and a metal cover having an aperture into which has been poured an ultra-violet glass window.

REFERENCES:
patent: 4025716 (1977-05-01), Morse
patent: 4709122 (1987-11-01), Samuels
IBM Technical Disclosure Bulletin, L. V. Auletta, vol. 17, No. 3, Aug. 1974, pp. 649-650.

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