Method of manufacturing an electronic circuit component incorpor

Details Method of manufacturing an electronic circuit component incorpor Method of manufacturing an electronic circuit component incorpor

1992-08-13

1993-04-13

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437217, 437220, 437902, H01L 2160

Patent

active

052022889

ABSTRACT:
A standard lead-frame has an aperture pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to respective parts of the lead frame the unit is encapsulate such a fashion that a major surface of the heat sink protrudes from the encapsulation.

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