Coil component and manufacturing method for the same

Inductor devices – Winding with terminals – taps – or coil conductor end...

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Details

336198, 336208, H01F 2729, H01F 2730

Patent

active

06100782&

ABSTRACT:
A coil component and a manufacturing method for producing the same permit a wire terminal to be bonded to an electrode with high reliability by implementing thermal compression bonding using a heater chip. The coil component comprises a bobbin around which a wire is wound, the wire having a solder layer on the outer peripheral surface of a core conductor and an insulating layer formed on the outer peripheral surface of the solder layer. The wire terminal is secured to the electrode provided on the bobbin by thermal compression bonding. A heated heater chip is applied to the terminal to break the insulating layer and to melt the solder layer at substantially the same time. Then, pressure is applied to the heater chip to provide intermetallic bonding between the core conductor and the electrode. Melted solder solidifies and covers the area around the core conductor, thereby securely bonding the wire terminal to the electrode.

REFERENCES:
patent: 4902867 (1990-02-01), Haramaki et al.
patent: 4950866 (1990-08-01), Kojima et al.
patent: 5153549 (1992-10-01), Morinaga
patent: 5457872 (1995-10-01), Sakata et al.
patent: 5497936 (1996-03-01), Vojta et al.

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