Apparatus for automated cutting of thin films

Cutting – Other than completely through work thickness or through work... – Scoring

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33 1M, 83 71, B26D 308

Patent

active

046241698

ABSTRACT:
A method and apparatus for use in chemical milling operations to automatically cut a maskant material, such as a thin film of plastic, which has been applied to the workpiece. The cutting device of the invention is designed for use with a computer controlled apparatus embodying a rectilinear robot adapted to move the cutting device in first, second and third directions relative to the workpiece. The pressural engagement between the cutting blade of the device and the workpiece is continuously sensed and controlled. Additionally, the angle between the cutting blade and the maskant is controllably varied as the cutting device is moved by the rectilinear robot.

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patent: 4391170 (1983-07-01), Boverman et al.
patent: 4426783 (1984-01-01), Gerber et al.
patent: 4479346 (1984-10-01), Chandler
patent: 4524894 (1985-06-01), Leblond

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