Solder bonding printed circuit boards

Details Solder bonding printed circuit boards Solder bonding printed circuit boards

1998-04-27

2000-08-08

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

22818022, 228187, 361779, 438613, H05K 111, B23K 3100

Patent

active

061004758

ABSTRACT:
The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus saving board area and reducing the interconnection length.

REFERENCES:
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 5275330 (1994-01-01), Issacs et al.
patent: 5337219 (1994-08-01), Carr et al.

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