Method for manufacturing thin film circuits

Details Method for manufacturing thin film circuits Method for manufacturing thin film circuits

1973-09-17

1976-11-02

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29 2542, 29620, 204 38A, 317256, 317258, 427 80, B01J 1700

Patent

active

039888240

ABSTRACT:
A thin film capacitor and resistor is disclosed, each capacitor being formed by a structure including a metallic film on an insulating substrate, the metallic film having an oxidized surface formed by anodizing, an oxide layer on the oxidized surface of the metallic film, and a pair of spaced-apart conductor layers over the oxide layer, each resistor being formed by a resistive film on the substrate and a pair of spaced-apart conductor layers connecting with the ends of the resistive film. In the manufacture of the circuit, a predeposited substrate is produced that may be utilized by circuit designers in the subsequent fabrication of custom microcircuits. A heat treating technique is employed in trimming the resistors of the circuit.

REFERENCES:
patent: 3201667 (1965-08-01), Varga
patent: 3407465 (1968-10-01), Ortel
patent: 3483451 (1969-12-01), Klerer
patent: 3537891 (1970-11-01), Rairden
patent: 3553545 (1971-01-01), Gerstenberg
patent: 3570114 (1971-03-01), Bean

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