Method for manufacturing dielectric filter

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

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427123, 427271, 427304, 4274431, B01J 1910

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active

060999195

ABSTRACT:
There is disclosed a method of manufacturing a dielectric filter in which the dielectric filter can be manufactured in a short time, machining accuracy is raised and a cutting tool is prevented from being easily damaged. First in a degreasing process (S1), a surface of a porcelain element body 2 is cleaned. In a surface roughing process (S2), in order to enhance the adhesion of a plating layer to be formed later, the surface of the porcelain element body 2 is etched to form a rough face. Subsequently, after a catalyzer layer is formed entirely on the surface of the porcelain element body 2 (S3), a portion of the catalyzer layer is removed with an ultrasonic cutter (S4). Then, formed is a region on which an insulating region is to be formed. Subsequently, in a plating process (S5), a conductive layer is formed on a region other than the insulating region. The dielectric filter is thus manufactured. Since the catalyzer layer is thin, it can be removed in a short time, and is superior in productivity. The ultrasonic cutter requires to provide only a small power. Therefore, machining accuracy is enhanced, and the running cost can be reduced.

REFERENCES:
patent: 4686114 (1987-08-01), Halliwell et al.
patent: 4870751 (1989-10-01), Antoon
patent: 4882200 (1989-11-01), Liu et al.
patent: 5474488 (1995-12-01), Yamamoto et al.
patent: 5499004 (1996-03-01), Noguchi et al.

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