Semiconductor plating bowl and method using anode shield

Details Semiconductor plating bowl and method using anode shield Semiconductor plating bowl and method using anode shield

1997-09-30

2000-08-08

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

204290R, 204275, 204157, C25D 502, H01L 21288, H01L 21445

Patent

active

060997125

ABSTRACT:
A semiconductor plating bowl which includes a shield on a consumable anode. The shield is preferably made from a dielectric material, such as a plastic. The shield is placed in the area upon which flowing plating fluid would otherwise impinge upon the processing workpiece. The shield has the surprising benefit of reducing the amount of organic additives consumed in the plating process. This is believed to occur because films that otherwise may form on the anode are not disrupted by the flow of plating liquids thereover.

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patent: 5670034 (1997-09-01), Lowery

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