Mounting apparatus for mounting small balls and mounting method

Details Mounting apparatus for mounting small balls and mounting method Mounting apparatus for mounting small balls and mounting method

1998-08-10

2000-08-08

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156292, 156382, 269 21, B32B 3100

Patent

active

060996811

ABSTRACT:
When applying a flux 2 kept in a container 16 onto a conductive ball 1, the flux 2 is first applied by a squeegee unit 17 on a bottom 16a of container 16 in the form of layer having a certain predetermined layer thickness. Then, a suction head 20 holding a solder ball 1 is lowered towards the container 16. As soon as a touch sensor 43 detects a touching of the solder ball 1 to the bottom 16a, the suction head 20 is lifted, and the solder ball 1 held to the suction head 20 is transferred onto a workpiece. Thus a solder ball 1 may be transferred onto a workpiece after being applied with a certain specific amount of flux 2 with precision.

REFERENCES:
patent: 5558732 (1996-09-01), Hamon

Affiliated with

Also associated with

Rating

Mounting apparatus for mounting small balls and mounting method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mounting apparatus for mounting small balls and mounting method , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mounting apparatus for mounting small balls and mounting method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1146687