Hybrid integrated circuit device

Details Hybrid integrated circuit device Hybrid integrated circuit device

1993-08-30

1995-11-21

Lateef, Marvin M.

Electrical resistors

With base extending along resistance element

338195, 338307, 338323, 338330, 338333, H01C 1012

Patent

active

054691311

ABSTRACT:
A resistive body of a hybrid integrated circuit has a resistance pattern on a resin film. Bonding pads permit connection of current through the resistance pattern. The resistance pattern may form part of a detecting bridge for overcurrent detection. One embodiment of the invention uses a rectangular resistance pattern with an opening in the center to force current to flow on a perimeter path for minimizing maximum temperature. Another embodiment uses a serpentine resistance pattern. A face-down resistance patter reduces interference. A direct-connection bonding pad reduces the voltage generated in a parasitic capacitance to improve the resistance of the resin film to voltage breakdown.

REFERENCES:
patent: 4196411 (1980-04-01), Kaufman
patent: 4204187 (1980-05-01), Kakuhashi et al.
patent: 4345465 (1982-08-01), Gruner et al.
patent: 4756756 (1988-07-01), Cassat
patent: 5262615 (1993-11-01), Hancock

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